Search results for: Kyung-Wook Paik
Journal of Materials Science: Materials in Electronics > 2019 > 30 > 19 > 17972- 17985
Journal of Materials Science: Materials in Electronics > 2019 > 30 > 10 > 9171-9183
SID Symposium Digest of Technical Papers > 49 > 1 > 1113 - 1116
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 12 > 2087 - 2094
Macromolecular Research > 2017 > 25 > 11 > 1105-1114
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 11 > 1759 - 1764
Microelectronics Reliability > 2017 > 78 > C > 181-189
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 10 > 1583 - 1591
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 8 > 1258 - 1264
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 8 > 1265 - 1271
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 3 > 371 - 378
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 3 > 450 - 455
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 12 > 1820 - 1826