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Additions of 1.5wt%Bi to Sn-0.7Cu-0.05Ni (SN100C) were investigated for their influence on mechanical properties and the IMC layer formed between the solder and Cu substrates. Solder balls of Sn-0.7Cu (Sn07Cu), SN100C, Sn-0.7Cu-0.05Ni-1.5Bi (SN100CV) and Sn-3Ag-0.5Cu (SAC) were reflowed onto Cu ball grid arrays (BGAs). They were examined in the as reflowed condition and after a heat treatment of annealing...
There is ongoing research seeking solders with improved performance under harsh environmental conditions, elevated operation temperatures, and higher mechanical loads while, at the same time, meeting new emerging requirements for the continuous miniaturization of electronics. Bi has been identified as one of the advantageous alloying elements that significantly improve solder performance. The present...
Effects of Bi additions to Ag-containing lead-free solders have been the focus of a considerable amount of past investigation. However, the influence of Bi on Sn-Cu-Ni solders has not been studied extensively. In the present study, we explore the influence of Bi on microstructure formation of Sn-0.7Cu-0.05Ni/Cu solder joints both in the bulk and at the interface. It is shown that (i) Sn-0.7Cu-0.05Ni...
The influence of trace level Ni additions on the eutectic solidification mode of Sn–0.7Cu has been studied using continuous torque experiments during solidification. The solid fraction at which resistance to paddle rotation at the thermal centre of the sample occurs is related to the spatial distribution of solid during solidification. The results indicate that a transition in solidification mode...
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