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The mechanical and vibration responses of 225-pin, 324-pin and 396-pin PBGA (plastic ball grid array) solder joints have been determined in this study. The effects of overload environmental stress factors on the mechanical responses of the solder joints have been determined by bending and twisting experiments. The effects of shipping and functional environmental stress factors on the vibration responses...
Studies of solder-bumped flip chips on organic substrates reported in the literature have so far suggested the necessity of a polymeric underfill to compensate for the large thermal mismatch between the silicon and the substrate. In this company's target applications of this process, the underfill not only has to meet the much published mechanical and chemical requirements, but also has to flow through...
Objectives: To determine the effect of percutaneous oestrogen replacement therapy on lipoprotein (a) and other plasma lipoproteins. Methods: Open longitudinal prospective study conducted at the hormone replacement clinic of the Prince of Wales Hospital, New Territories, Hong Kong. Thirty women who had undergone a total abdominal hysterectomy and bilateral salpingo-oophorectomy for benign gynaecological...
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