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Thermomechanical modeling for interconnects and electronic packages is a difficult challenge, especially for material interfaces and films under 1 ??m dimension. Understanding and prediction of their mechanical failure require the simulation of material behavior in the presence of multiple length scales. However, the classical continuum theory is not capable of predicting failure without a posterior...
In this study, peridynamic theory is used to investigate dynamic response of electronic packages subjected to impact loading arising from drop-shock. First, the theory is briefly described, followed by validation against a fundamental dynamic fracture problem. Finally, peridynamic theory was demonstrated by considering a drop test experiment.
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