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A novel self-normalized weighted bit-flipping (SNWBF) decoding algorithm for low-density parity-check (LDPC) codes is proposed. Compared to the best known weighted bit-flipping decoding, the SNWBF algorithm converges significantly faster but with little performance penalty. For decoding of LDPC codes, the proposed SNWBF algorithm considers not only the reliability of the neighboring check nodes, but...
Micro-grid technologies have greatly attracted attention due to quick development of distribution energy resources. Micro-grid studied by researchers primarily includes AC micro-grid, DC micro-grid and AC-DC hybrid micro-grid. The advantages and application of these three types of micro-grids have been introduced and analyzed in this paper. The grid architecture, energy management, operation control...
This paper builds on an approach developed by the authors for extending IDEF0 modelling to act as a process reliability assessment tool. By quantifying the quality of the activity inputs the approach is able to assess the quality of activity outputs. The paper addresses how this approach is applied at a higher level to represent existing project management frameworks to improve their applicability...
Team has become one of the most important strategic resources in the organization. However, the overall effect of team is often difficult to achieve in the practical application of team in China's enterprises. According to the investigation of high technology innovation teams and the relative literature reviews, the team climate is an important influencing factor for achieving the overall effect of...
Dynamic voltage and frequency scaling (DVFS) technique is emerging in various battery-operated embedded systems to reduce the energy consumption and prolong the working life of the system. However, DVFS technology has been proved to have some direct and negative effects on the reliability of the system. Most existing schedulers of real-time tasks based on DVFS only focus on minimizing energy consumption...
During the transition from Sn-Pb solder to lead-free solder, it is inevitable to encounter the reliability difficulties when lead-free and Sn-Pb materials were used within the same mounting process. To solve the problem in the mixed soldering, two methods were adopted that is improving the soldering temperature and electroplating Sn-Pb on the surface of the devices then soldering in a lower temperature...
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