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A pyrophosphate and iodide based bath was investigated for the electrodeposition of near-eutectic Sn–Ag–Cu alloys, which are promising lead-free solder candidates for electronics interconnection. Near-eutectic Sn–Ag–Cu electrodeposits (2.5–4.2wt.% Ag and 0.7–1.5wt.% Cu) were achieved from the system as measured by wavelength dispersive X-ray spectroscopy (WDS). Electroplating such near-eutectic ternary...
A pyrophosphate and iodide based bath was investigated for the electrodeposition of near-eutectic Sn-Ag-Cu alloy, which is one of the promising lead-free solder candidates for electronics interconnection. The bath contained pyrophosphate and iodide as chelating agents. The composition of electrodeposits were measured by wavelength dispersive X-ray spectroscopy (WDS). Different morphologies of deposited...
Eutectic Sn-Cu alloy is one of the lead-free solder candidates for electronics interconnection. The methanesulphonic acid based baths were investigated for the electrodeposition of Sn-Cu alloys. The effect of iso-octyl phenoxy polyethoxy ethanol (Triton X-100) as a surfactant was studied, its addition proved to facilitate achieving the near eutectic composition of Sn-Cu alloy with improved microstructure...
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