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This work introduced a novelty MEMS pyroelectric infrared detector based on LiTaO3 (LT) crystal with high absorptivity amorphous carbon film layer. The LT crystal is thined and polished to 100um thickness and double mentaled for electical connection which will be suspened upon rectangle cave of silicon substrate with mental ring. Amorphous carbon(a-C) could be produced by magnetron sputtering on the...
This paper compared the fatigue damage accumulation of the gold-tin eutectic die attach layer in different high electron mobility transistor (HEMT) packages with various types of die attach layers and substrates under thermal cyclic loading. The fatigue damage per cycle used in this study was characterized by the accumulation of plastic work, which was derived by the finite element analysis (FEA)...
In this paper, a new-version microstrip line is proposed, named packaged microstrip line. It is comprised of three dielectric substrates. This novel microstrip line is no longer suffering from the issues of radiation losses, surface waves, or cavity resonances that exist in the standard microstrip line without or with a metallic shielding box. Instead of the packaging way based on the standard air...
Phosphor-free monolithic high-efficiency tunable white LEDs are realized on ternary InGaN substrates. This proof-of-concept study demonstrates that high quantum efficiency and stable white color emission are achieved by using ternary substrates and correctly-engineered device structures.
We show that heteroepitaxy of thin films of InP on Al0.48In0.52As by MOVPE does not result in continuous flat layer growth, but instead develops a number of low dimensional structures, e.g. quantum dots and rings. We consider local phase separation/alloying-induced strain and preferred aggregation of adatom species on the substrate surface together with reduced wettability of InP on AlInAs to be the...
This paper presents three related planar EBG (electromagnetic bandgap) structures based on embedded capacitors and inductors, which have small-footprints and can be used in package power or ground planes to provide wideband isolation among different parts of the power distribution network (PDN). Measurement shows −40dB isolation from 2–2.5GHz to over 10GHz. In order to improve performance at lower...
This paper presents fabrication and electrical characterization of embedded passives in organic multilayered substrates. We have designed and fabricated a test board and a functional application focusing on embedded passives. A test board with two embedded capacitor layers and one embedded resistor layer was used to evaluate capacitance and resistance performance. The functional application was used...
Optical gain properties of InGaN quantum wells on ternary substrates are analyzed for visible lasers. Larger optical gains are obtained by employing ternary substrates, which indicate its potential for green-emitting diode lasers.
3D system-in-package has recently been considered a major enabler for high density and heterogeneous microsystem integration. We hereby proposed the concept of a unified micromachining and packaging platform based on LTCC (low temperature cofired ceramic) material system and process, which is implemented by first enhancing an existing LTCC hybrid IC fabrication line and then integrating different...
When a micro cantilever with a nanoscale tip is manipulated on a substrate with atomic roughness, e.g., pushing an atomic-scale sample or etching the surface of the substrate to draw desired patterns, the periodical lateral frictional forces with stochastic fluctuations will induce stick-slip motion of the cantilever tip, which may greatly influence the precision of the nano manipulation. To reduce...
This paper reports the designing, simulation and initial experimental investigation into a LTCC vacuum microsystem package substrate acting both as a vital panel and a functional structure for compact system-in-package (SiP) integration. Design, validation and experimental results for microchannels with different planar axial shapes are presented. Experimental and simulated temperature distribution...
The heat dissipation of six different types of microchannel networks integrated in LTCC based microsystems has been investigated by experimental measurement and simulation analysis, including straight, serpentine, spiral and fractal-shaped microchannel networks of curve, I-shaped and parallel. The cross section of microchannel is 200 ??m ?? 200 ??m and the total length is about 200 mm. The water mass...
The photoelectric properties and their dependences on Nb dopant concentration of SrTiO3/Nb: SrTiO3 heterojunctions were investigated. The charge transferring and impurity levels at the interface of the heterostructures could account for the results.
With the development of three-dimensional low temperature co-fired ceramic (LTCC) packaging substrate, the internal microscale structures have great effect on the strength, toughness and lifetime of LTCC microsystem, where the study of local or nanoscale mechanical properties and microstructure is critical, especial for the prediction of the local failure behaviors. In this study, the nanoscale mechanical...
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