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The development of ultrafine-pitch microbumps and the thermal compression bonding (TCB) process for advanced 3-D stacking technology are discussed in this paper. Microbumps, consisting of Cu pillars and thin Sn caps with a pitch of 25 , are fabricated on an Si chip by the electroplating method. Total thickness of the Cu pillar and the Sn cap is 10 . Electroless nickel and immersion...
In recently years, the continued demand for electronic systems and subsystems with more functionality, higher electrical performance, smaller size and lower cost, the conventional packaging and interconnect technologies already can not be met for it's requirement, so system-in-package (SiP) modules have been growing rapidly. As a packaging technology platform, SiP allows a high degree of flexibility,...
The submodeling technique is a powerful analysis tool. The method promotes more accurate analysis and also helps enhance productivity. It has been shown that by using displacement-force cut boundary condition method, it can be made even more versatile. The local stress phenomena of the solder microbump have been solved with this approach to demonstrate the concept. From the simulation model, it is...
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