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Considering that solder surface may lose its brightness due to oxidation during the assembly and operation of electronic device, this study investigated the surface properties of Sn-Cu-Ni solders using UV-visible and X-ray photoelectron spectroscopies. The degree of discoloring could be evaluated by the reflectance of the sample surface in the visible light range. Two distinct absorption peaks respectively...
The effect of transition metal (TM) additive of Ni, Co or Zn on the interfacial reactions of the solder joints between Sn-Ag-Cu (SAC) solder and the Cu/Ni(P)/Au substrate was investigated, especially when subsequent to multi-reflowing. (Cu,Ni)6Sn5 formed at the interface of all the joints but the SAC-Ni of which the interfacial compound was (Ni,Cu)6Sn5. The interfacial compounds of the SAC-Co and...
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