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Three types of interfacial nanostructure are identified in as-bonded Cu–Al bonds: (1) Cu/~5nm amorphous alumina layer/Al; (2) Cu/~20nm CuAl2 intermetallic particle/Al; and (3) Cu/Al. During annealing, in the areas of latter two types where alumina layer is fragmented, Cu9Al4 and CuAl form as second and third intermetallic layers, and grow vertically and fast together with initial CuAl2. In the area...
This paper describes the behavior of palladium in palladium-coated Cu (PdCu) wire bonding and its impact on bond reliability by utilizing transmission electron microscopy (TEM). A Pd layer approximately 80nm thick, which is coated on the surface of Cu wire, dissolves into the Cu matrix during ball formation (under N 2 gas protection) when the wire tip is melted to form a ball. As a result...
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