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In addition to chemical jet etch method, decapsulation performances of electronic packages for failure analysis are virtually enhanced using lasers. Nevertheless circuits inside package could be subjected to a local thermal elevation during the package ablation process. In this paper, we introduce an innovative technique to measure the thermal behavior of an encapsulated system in situ and in real...
In this paper the solder fatigue of WLCSP (wafer level chip scale packages) assemblies is studied and a comparison with flip chip BGA is made. Previous works have already shown that for BGA, the most critical parameters are size, thickness, and underfill. We have evaluated both by thermal cycling and by simulations the effect of thickness and underfill in the WLCSP's case. WLCSP devices with a size...
Fast and accurate decapsulation of integrated circuits packages is a key step of successful further observations and defect localization in microelectronics analysis laboratories. In addition to classical techniques, laser technology was introduced to enhance considerably performance in creating precise and local exposure of selective sub layers in complex system in package (SiP). In this paper, we...
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