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Metal-Oxide-Semiconductor Field Effect Transistors MOSFETs (MOSFETs) transistor have been scaled tremendously through Moore's Law since 1974 in order to compact transistors in a single chip. Thus, a proper scaling technique is compulsory to minimize the short channel effect (SCE) problems. In this paper, the virtual fabricated design and device's characterization of 14 nm HfO2/WSi2 n-type MOSFET device...
This paper describes growth process of the two silicide Sub-nanometer devices and the different effects of having cobalt silicide and titanium silicide on a Sub-nanometer CMOS devices. On the top of CMOS device gate, metal silicide is developed on-top of the polysilicon to produce an ohmic contact between the polysilicon and aluminum wire. The ohmic contact should be better compared to metal-polysilicon...
Taguchi method was used to optimize of the effect process parameter variations on threshold voltage in 45nm NMOS device. In this paper, there are four process parameters (factors) were used, which are Halo Implantation, Source/Drain (S/D) Implantation, Oxide Growth Temperature and Silicide Anneal temperature. The virtual fabrication of the devices was performed by using ATHENA module. While the electrical...
In this paper, we investigate the properties of a submicron pMOS with a single layer of metallization. The fabrication process and electrical characterization of the device were simulated using the SILVACO TCAD tools. We have applied constant field scaling on the effective channel length, the density of ion implantation for threshold voltage adjustment, and gate oxide thickness. To suppress short...
This paper describes the effect of fabrication process noises to Sub-nanometer devices, which in this case a 32nm NMOS transistor. This experiment a part of a full Taguchi Method analysis to obtain an optimum fabrication recipe for the said transistor. The two noises introduced in the fabrication is ±1°C variation in sacrificial oxide layer growth by diffusion temperature and also silicide compress...
The characteristics of high performance 45 nm pMOS devices based on International Technology Roadmap for Semiconductor (ITRS) have been studied using ATHENA and ATLAS's simulator. There are four factors were varied for 3 levels to perform 9 experiments. The factors are halo implantation, Source/Drain (S/D) implantation, oxide growth temperature and silicide anneal temperature. In this paper, Taguchi...
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