The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Improved resistive switching memory characteristics in a W/Ti/Ta2O5/W device with a small size of 150 nm have been investigated for the first time. TEM image shows amorphous Ta2O5 film with a thickness of ~7 nm. Memory device has a good repeatable bipolar memory behavior and a large sensing margin of ~2000. The memory device has shown good endurance of at least 104 cycles and excellent data retention...
The (anode) TiN/Ti/HfO2/TiN (cathode) resistive random access memory (RRAM) has shown yield ~100%. Its simple metal-insulator-metal (MIM) structure exhibits great potential for an embedded BEOL memory compatible with the high-k/metal gate CMOS process. There have been many theories of RRAM physical mechanism in the literature. This paper focuses on HfO2-based RRAM and describes a complete physical...
Low current/voltage (1 nA/1.3V) operation of resistive switching memory device using Cu metallic filament in Ge0.2Se0.8 solid-electrolyte has been investigated. This resistive memory device have a large resistance ratio of > 10 at 1 nA current compliance, good endurance of ~105 cycles, and good data retention with a current of 1 nA up to 2×103 seconds. The low resistance state decreases with increasing...
In this paper, the bipolar resistive switching memory using HfO2 film with a TiN/Ti bi-layer electrode is reported. A robust endurance (>106 cycles) and long data retention (>10 years at 200degC) of this memory device was achieved. The memory also shows fast operation speed (~10 ns), low operation power and capability of multi-level operation.
Low current/voltage (~10 nA/1.0V) resistive switching memory device in a Cu/Ta2O5/W structure has been proposed. The low resistance state (RLow) of the memory device decreases with increasing the programming current from 10 nA to 1 mA, which can be useful for multi-level of data storage. This resistive memory devices have stable threshold voltage, good resistance ratio (RHigh/RLow) of 5.3times107,...
A novel method of fabricating HfOx-based resistive memory device with excellent nonvolatile characteristics is proposed. By using a thin AlCu layer as the reactive buffer layer into the anodic side of a capacitor-like memory cell, excellent memory performances, which include reliable programming/erasing endurance (> 105 cycles), robust data retention at high temperature, and fast operation speed...
A novel HfO2-based resistive memory with the TiN electrodes is proposed and fully integrated with 0.18 mum CMOS technology. By using a thin Ti layer as the reactive buffer layer into the anodic side of capacitor-like memory cell, excellent memory performances, such as low operation current (down to 25 muA), high on/off resistance ratio (above 1,000), fast switching speed (5 ns), satisfactory switching...
A novel characterization metric for phase change memory based on the measured cell resistance during RESET programming is introduced. We show that this dasiadynamic resistancepsila (Rd) is inversely related to the programming current (I), as Rd = [A/I] + B. While the slope parameter A depends only on the intrinsic properties of the phase change material, the intercept B also depends on the effective...
In this paper, a detailed study on the etching characteristics of nitrogen doped Ge2Sb2Te5 (N:GST) thin films is performed to elucidate the relationship between pattern fidelity and material modification. Multiple methodologies ranging from physical sputtering to chemically driven reactive etching are shown to successfully pattern highly anisotropic features in N:GST films while the advantages and...
A novel PCM cell with double GST thermally confined structure was proposed and fabricated in this work. by inserting an extra bottom GST layer under the confined GST region, the heat loss can be effectively prevented and the temperature profile over active region becomes more uniform. thus, a low reset current less than 0.3 ma can be achieved and the set performance is also improved to be faster than...
In this paper, a new application of phase change material GeSnSbTe (GSST) is proposed for high-speed phase-change memory (PCM). The device characteristics of PCM employing GeSnSbTe and conventional Ge2Sb2Te5 (GST) are compared. Because of high crystallization speed, the GSST device demonstrates the benefits of shorter SET pulse, lower SET current, and higher resistance ratio.
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.