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The SnSbNi solder pastes were reflowed at 270°C and 280°C between the MvpLED chip and the AlN ceramic substrate, and then the SnSbNi solder joints were aged respectively at 200°C for 1h and at 250°C for 3h. The interfacial microstructure and constituents were investigated by SEM and EDS. After the reflow reactions, a thin layer of IMCs was formed at the chip/solder and solder/substrate interfaces,...
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