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Electroless plating of copper onto insulating substrates is a process broadly applied in the electronics industry for manufacture of printed circuit boards and decorative plating of plastic parts for automotive or consumer appliance. The key step involves surface activation of the dielectric surface for deposition in electroless copper bath. Palladium catalyst, either in its ionic form or metallic...
Surface activation is an essential step in metallization of dielectric surface, which works together with the following electrolytic plating to build electrical connections between different layers of printed circuit boards (PCBs) or to build decorative and functional finishing layers of plastic substrates. Palladium, either in its ionic form or metallic form, is a traditional catalyst for many chemical...
One of the most challenging issues for printed circuit board (PCB) production is the metal plating at non-plated through holes (NPTH) during electroless nickel and immersion gold process (ENIG). It is believed that the undesired metal plating was induced by the excess palladium catalyst, which was adsorbed on the rough surface of the NPTH walls at the stage of make hole conductive process (MHC). The...
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