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A novel semi-fluxless die-to-die bonding solution is presented, developed and successfully tested. Consisting of patterned thin film lead-free solder, this method was developed to meet the constraints given by the integration of state-of-the-art cooling structures into a 3D chip stack, such as minimizing the gap between the dies, sealing the active solder pads from a conductive coolant fluid and sealing...
Ever increasing device density in electronic chips is beneficial for enhancing their computing efficiency. However, it also introduces severe challenges with respect to cooling solution which are indispensible for ensuring a reliable chip operation. Such steady miniaturization will soon render the traditional air cooling strategies futile and make the switching to liquid cooling inevitable. Superior...
The following study focuses on the scalability of single- and two-phase cooling techniques to address the cooling constraints and requirements of future vertically integrated chips. Water and refrigerant R134a were considered for single- and two-phase cooling respectively during simulations. A parametric study based on fin height, fin width and channel width of multi-microchannel heat removal structures...
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