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The story of copper wire has existed for decades, and it always looked to be a very promising material. However, despite all of its positive properties copper bonding wire never managed to find such a wide use as did gold wire. In recent years many semiconductor manufacturers made great efforts to replace gold with copper wire. Driving forces are the high gold price and some design benefits due to...
Over the past few years the trend in bonding wire applications has been characterized by the minimisation of assembling components, and has in turn led to thinner wire and finer pad and pitch size. In particular for gold bonding thinner wire means less expense for precious metal. The requirements for such small wire diameters can only partially be met by the existing bonding wires types. In fact,...
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