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The paper presents details about the adequate experimental determination of the Young's modulus on miniaturized specimens for material used in electronic packaging. The difficulty to determine accurately the Young's modulus is caused by the requirements of representative specimens for the area of electronic packaging. In many cases such specimens, e.g. solder balls, are connected with the issues of...
The scope of the paper is to present the result of the determination of mechanical material properties of a SAC based solder at high strain rates. Miniature bulk specimens which have a diameter comparable to BGA joints are used to investigate the solder behaviour experimentally. Stress and strain data are recorded at high strain rates using a high resolution tensile test setup. Explicit FEM methodology...
The scope of the paper is to present the result of a characterisation methodology to determine solder mechanical material properties at high strain rates. Considering volume effects miniature bulk specimens with dimensions comparable to BGA joints are used in the experiments. Stress-strain data recorded at high strain rates proof the high resolution capability of a novel tensile setup. To improve...
The scope of the paper is to present the result of combining experimental and simulation methodologies to determine mechanical material properties at high strain rates. Miniature bulk specimens which have a diameter comparable to BGA joints are used in the experiments. Stress-strain data recorded at high strain rates proof the high resolution capability of a novel tensile setup. A FEM model of the...
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