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In this work we present transient reflectivity measurements, maximum melt depths, and surface topographies of ion implanted silicon samples after pulsed excimer laser thermal annealing in the melting regime. The samples were annealed with different laser energies and number of pulses. We found that the melt dynamics change after the first laser pulse resulting in a shorter melt time but deeper melt...
The influence of temperature variations during flash annealing on contact resistances in 6-T SRAM cells was studied. TCAD simulations of 32 nm single gate FD SOI devices were carried out. The active regions of a 6-T SRAM cell were simulated by 3D process simulations to calculate the Schottky contact resistances. A coupled spike and flash annealing scheme was used to anneal the devices. Flash annealing...
In this work, the influences of advanced annealing schemes, spike and flash annealing and combinations of them, on the electrical behavior of modern FD SOI MOSFETs have been investigated by numerical simulations. Process simulations have been performed for comparing the two-dimensional diffusion behavior of the dopants under the different annealing schemes. Device simulations have been performed for...
For the measurement of dopant concentrations in two dimensions (2d), a delineation technique has been optimized. The method yields up to three dopant equiconcentration lines in one sample. The concentrations of these lines can be changed by modification of the etching conditions. This technique is applied to the investigation of 2d ion implantation profiles.
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