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We have demonstrated 1200V and 3300V planar 4H-SiC MOSFET technology at our 6-inch foundry. 1200V MOSFETs demonstrate good avalanche ruggedness under single-and one million (1,000,000) repetitive unclamped inductive switching (UIS) pulse tests. 1200V MOSFETs can pass one hundred (100) 10 microsecond short-circuit events at 600V bus voltage, while 3300V MOSFETs can pass 5 microsecond short-circuit...
We have fabricated ultra-narrow (sub-10 nm) short channel (100 nm) silicon (Si) nanowire transistors with atomically flat interfaces based on Si-on-Insulator (SOI) substrates. The raised source and drain electrodes were patterned together with the gate electrode. The smaller threshold voltage in the narrower nanowire suggests self-limiting oxidation during the gate oxide formation.
We have found a systematic way to identify the bias conditions to observe the Random-Telegraph-Noise (RTN) in advanced Metal-Oxide-Semiconductor Field-Effect-Transistors (MOSFETs). We measured a p-type MOSFET at 2K, and found narrow bias conditions to observe the RTN presumably caused by charge trapping and de-trapping, which were only observed at low temperatures. It will pave the way to address...
This paper reports on the technology and design aspects of an industrial DHEMT process for 650V rated GaN-on-Si power devices, using an in-situ MOCVD grown SiN as surface passivation and gate dielectric, with low interface state density and excellent TDDB. Optimization of the GaN epi stack results in very low off-state leakage (<10nA/mm). Due to the reduction of buffer trapping, low dynamic Ron...
This paper reports on an industrial DHEMT process for 650V rated GaN-on-Si power devices. The MISHEMT transistors use an in-situ MOCVD grown SiN as surface passivation and gate dielectric. Excellent off-state leakage, on-state conduction and low device capacitance and dynamic Ron is obtained. Initial assessment of the intrinsic reliability data on the in-situ SiN is provided.
As technology has advanced, layout dependent device parameter shifts are becoming more influential to the actual circuit operation and performance, such that design style differences could create systematic device variability due to layout unless those effect are minimized and well captured in the device model[1]. In this paper, we characterize the device layout effects on a high performance planar...
We present industry's smallest eDRAM cell and the densest embedded memory integrated into the highest performance 32nm High-K Metal Gate (HKMG) SOI based logic technology. The cell is aggressively scaled at 58% (vs. 45nm) and features the key innovation of High-K Metal (HK/M) stack in the Deep Trench (DT) capacitor. This has enabled 25% higher capacitance and 70% lower resistance compared to conventional...
A novel gate first integration approach enabling ultra low-EOT is demonstrated. HfO2 based devices with a zero interface layer and optimized gate-electrode is used to achieve EOT and Tinv values of ˜5 Å and ˜8 Å respectively for both n and pMOS devices. The drive currents at Ioff=100 nA/μm with VDD=1 V is 1.4 mA/μm and 0.6 mA/μm (no SiGe source/drain) for n and pMOS respectively. The technology further...
We have studied and optimized the breakdown voltage of enhancement-mode n-channel GaN hybrid MOS-HEMTs on sapphire substrate. These MOS-gated transistors, with different Mg doped p-type GaN layer underneath the unintentional doped AlGaN/GaN layer, have breakdown voltage as high as 1300 V using a dielectric isolation (DI) RESURF approach.
Two SMSD gate first planar CMOS devices were demonstrated. Vtn/Vtp= +0.49V/-0.48V were achieved by adjusting TiN to p-like metal and As I/I on nMOS. This enables the equivalent +/-0.2V low Vt target of N22 fully depleted CMOS technologies. Vtn/Vtp= 0.52/-0.55 were obtained by transforming PVD-TiN/Ti into n-like metal TiN/TiSix for nMOS and by Al I/I on TiN/Ti for pMOS. Al diffusion was facilitated...
In this paper, the effects of the output peaking capacitor on the underwater streamer propagation are reported. A copper needle with 0.43 mm in diameter was used as a high voltage electrode, and an Aluminium plate was connected to ground with a 2cm gap from needle tip. Pulsed streamer propagation in tap water with conductivity of 225µS/cm was observed using an intensified charge-coupled display (ICCD)...
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