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In this paper we propose a detailed investigation on the electrical response of Organic Field Effect Transistors (OFETs) assembled on flexible plastic substrates to mechanical deformations. We will demonstrate that, by applying a surface deformation by an external mechanical stimulus we are inducing morphological and structural changes in the organic semiconductor, giving rise to a marked, reproducible...
In this paper, we have studied the Id variation in linear and saturation region by considering the strain-induced effect and the carrier transport of strained CMOS devices. It was found that the origin of linear Id variation comes from the mobility scattering; while in saturation region, the Id variation is dominated by the injection velocity. The higher the injection velocity is, the smaller the...
In this paper, a series of PCB strain-to-fatigue life characteristics were generated at a constant bending frequency of 100Hz for different material combinations: eutectic SnPb solder, SAC101 solder, and In/Ni-doped SAC101 solder, assembled on PCB with OSP and ENIG finish respectively. As expected, SAC101 solder exhibits similar performance as eutectic SnPb solder, and solder joints on OSP finish...
Due to rapid and continual changes in the components and designs of portable electronic devices, it is essential to have the ability to perform quick, cost-effective and accurate assessments of the drop impact performance of component interconnections for portable applications. In order to understand the phenomena of solder joint fatigue under impact-induced PCB bending, a tester was developed specifically...
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