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3D system integration is a fast growing field that encompasses different types of technologies. The technology chosen for a specific application will be selected according to the required electrical performance of the systems, the footprint, cost and time to market. Other important factors are the boundary conditions given for the specific components e.g. die size, integration compatibility, component...
Most of the wafer level 3-D technologies are using Through-Silicon Vias (TSV). The main barriers for these approaches are high cost, issues with electrical isolation within the Si via and the need of high investments for new equipment which is not used in WLP up to now. A planar integration technology of ultra-thin bare dice in a Wafer-Level Thin Film technology yield to a high-dense module will be...
3D system integration is a fast growing field that encompasses different types of technologies. The technology chosen for a specific application will be selected according to the required electrical performance of the systems, the footprint, cost and time to market. Other important factors are the boundary conditions given for the specific components e.g. die size, integration compatibility, component...
Chronically implantable, wireless neural interfaces require biocompatible, long term stable, and high density integration of all functional sub-components. For this, the integration and interconnection concept of the wireless neural interface was proposed and interconnection materials and methods were investigated and characterized. The module consists of an electronics IC assembled to an electrode...
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