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Ultra-thin InGaAs gate stacks with CET= 0.73 nm (EOT< 0.5 nm), Dit as low as 8.0×1011 (cm−2 eV−1) and thermal stability up to 600°C is demonstrated by using La2O3 as gate dielectric. A silicide/InGaAs junction with excellent controllability at the interface is also proposed. These results promise the integration compatibility of this gate stack for future node 3D device structures.
Metal induced effects on electrical characteristics in AlGaN/GaN Schottky HEMT are reported. Focus is given to the collapse of drain current attributed to Schottky metal. Of particular interest for discussion is that TiN gate can suppresses the collapse of drain current compared with conventional Ni gate. Nitrogen concentrations in TiN gate are found to be correlated to the current collapse, indicating...
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