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Critical parameters of low-k films were defined to keep capacitance benefit and TDDB reliability in the scaling BEOL module, according to various analyses. In order to meet the criteria of high carbon content, low porosity with small pores, and high adhesion strength with less adhesion layer, precursor and process were designed for the SiOCH with k∼2.5. The benefits in integration and reliability...
High performance Cu dual-damascene (DD) interconnects without process-induced damages are developed in porous SiOCH stacks with the effective dielectric constant (keff) of 2.95, in which a carbon (C)-rich molecular-pore-stacking (MPS) SiOCH film (k = 2.5) is stacked directly on an oxygen (O)-rich porous SiOCH (k = 2.7) film. The novel etch-stopperless structure is obtained by comprehensive chemistry...
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