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7nm CMOS FinFET technology featuring EUV lithography, 4th gen. dual Fin and 2nd gen. multi-eWF gate stack is presented, providing 20% faster speed or consuming 35% less total power over 10nm technology [1]. EUV lithography, fully applied to MOL contacts and minimum-pitched metal/via interconnects, can reduce >25% mask steps with higher fidelity and smaller CD variation. AVT of 6T HD SRAM cell are...
A new joint research project (JRP) integrating metrology institutes and universities from nine countries is aimed at realization of a new generation of standards for quantum resistance metrology. The project exploits graphene's properties to simplify operation of standards without compromising the unprecedented precision delivered by semiconductor quantum Hall devices. Higher operating temperatures...
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