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The market of Connectivity, Internet of Things (IoT), Wearable and Smart industrial applications leads Fan Out Wafer Level Package (FOWLP) technologies to a promising solution to overcome the limitation of conventional wafer level package, flip chip package and wire bonding package in terms of the solution of low cost, high performance and smaller form factor packaging. Moreover, FOWLP technology...
We demonstrate reliable RRAM operation by controlling the forming energy via short voltage pulses (picosecond range) which eliminates the need for a current compliance element. We further show that the dissipated energy during forming and SET/RESET processes plays a critical role. The SET/RESET cycling endurance of thus formed devices is shown to also be dependent on the SET/RESET energy. Multiple-pulse...
64 Mb FRAM with a 1T1C scheme has progressed greatly for mass production in terms of a highly reliable device. For the first time, package-level reliabilities of the memory were evaluated systematically and massively. The authors scrutinized the device reliabilities in accelerated manners, one of which is high-temperature-operating-life (HTOL) test; and the other is high-temperature-storage (HTS)...
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