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The heat generated by self-propagating exothermic reaction can be used to melt solder and then join the components. However, the microstructure of self-propagating interconnects is different from those obtained through traditional soldering process for its unique thermal conditions. In this paper, a finite element model was established to simulate the temperature field of self-propagating joints at...
Self-propagating reaction is presented as a new heat source for the joining of MEMS and high power devices. However, due to the complex thermal process of self-propagating reaction, the temperature in solder or multilayer foil during the joining process is difficult or even impossible to measure and control. Therefore, more simulation efforts should be carried out to get a better understanding of...
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