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Self-propagating exothermic reaction of Al/Ni multilayer film has been developed as a heat source with small heat region and high reaction rate in the field of bonding. In this paper, using this kind of localized and rapid heat source, solder preforms with different melting point such as SAC305 (217°C), Au80Sn20 (278°C) and A88Ge12 (356°C) have been applied to achieve the Si/Si bonding includes stacked...
A rapid and flexible Cu/Cu soldering process has been developed through self-propagating exothermic reaction (SPER) using Al–Ni multilayer nano-film as heat source. The localized intensive heat generated by SPER has a short affecting time and thus a low thermal impact, which promises various potential benefits for electronics interconnects, including the reduction of stress caused by CTE (coefficient...
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