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This paper presents complementary-metal–oxide–semiconductor-compatible silicon-embedding techniques for on-chip integration of microelectromechanical-system devices with 3-D complex structures. By taking advantage of the “dead volume” within the bulk of the silicon wafer, functional devices with large profile can be embedded into the substrate without consuming valuable die area on the wafer surface...
This paper presents batch microfabrication and experimental characterization of solenoid inductors with electrodeposited silver windings and laminated core. To enable high-frequency operation, the metallic magnetic core consists of multiple air-insulated, electroplated micron-thick permalloy (Ni80Fe20) laminations, with total core thicknesses up to tens of microns. The core is achieved by sequential...
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