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In this study, the reliability of several potential interconnect methods for high temperature applications are evaluated by using accelerated thermal cyclic tests on typical LED test carriers. The applied interconnect materials are SAC (Sn-Ag-Cu), SAC+(SAC with doping elements), and an eutectic AuSn solder alloy. The degradation behavior and typical failure modes in the different interconnect materials...
This paper gives a comprehensive overview of literature data on the reliability of different alternative Pb-free assembly technologies for high temperature applications with 4 groups of materials: SAC based solder alloys, Silver filled epoxies, Eutectic AuSn solder and a thermal interface material. For each group, the typical degradation models and mechanism of different material compositions in the...
More and more, reliability is seen as a key differentiator in an extremely competitive globalized market. Recent examples from the automotive sector illustrate very well how serious the impact from field problems can be, more in particular when safety risks are possibly involved: liability claims, recall actions, negative effect on the market share of a brand and so on. But how to match the growing...
Light Emitting Diodes (LED) are being implemented more and more into demanding applications like automotive and high-brightness general lighting. From the reliability point of view, the automotive environment is extremely harsh and challenging. Automotive electronics have to withstand exposure to high temperature fluctuations, mechanical shock impacts and vibration. The cyclic thermal load of solder...
Adhesive interconnections are considered to be attractive alternatives to lead or lead-free solder interconnects because of their lower processing temperatures and extendability to fine pitch applications. However, reliability issues, such as moisture-induced delamination and viscoelastic relaxation of the adhesive in both steady-state and cyclic loading, continue to pose a challenge to widespread...
Abstract The present study evaluated the effect of starvation and of feeding various algal and lipid-supplemented diets on the lipid content and lipid class distribution in the polar and neutral lipids of early juvenile oysters (Crassostrea gigas) and clams (Tapes philippinarum L.). T. philippinarum was starved, fed a mixed algal diet [Tetraselmis suecica and Isochrysis galbana (clone T-Iso)] or solely...
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