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The existence of microcracks in solder interconnects plays a key role in determining the performance and reliability of solder interconnects, in particular, may increase significantly the potential for brittle interfacial fracture of interconnects and reduce the thermal conductivity of the systems. Thus, characterization of the formation and propagation of microcracks is very important for evaluating...
A new adaptive interphase backup protection scheme based on intelligent electronic devices (IEDs) is proposed in this paper. When the system is in normal operation state, the backup protection areas are divided according to the operation status and topology of the primary and secondary devices in the power grid. When fault is detected in the system, each IED will search for the other IEDs in the same...
During the soldering process, Kirkendall voids may form at the Cu/Cu3Sn interface and in Cu3Sn compound layer. Excessive formation and growth of Kirkendall voids may increase the potential for brittle interfacial fracture, and the existence of voids will reduce the thermal conductivity. Thus, characterization of formation and growth of Kirkendall voids is very important to the evaluation of performance...
During the soldering process, Kirkendall voids may form at the Cu/Cu3Sn interface and in Cu3Sn compound layer. Excessive formation and growth of Kirkendall voids may increase the potential for brittle interfacial fracture, and the existence of voids will reduce the thermal conductivity. Thus, characterization of formation and growth of Kirkendall voids is very important to the evaluation of performance...
The continuous-state fault tree (CSFT) is used for reliability analysis for the degradation performance of SLD. Firstly, the degradation performance of SLD is analyzed and the methods of building CSFT are proposed. Based on CSFT, the formula for reliability is deduced. Secondly, the reliability quantitative analysis of SLD is introduced based on the building CSFT of SLD. Thirdly, the reliability curve...
As a new type of rotation sensor, the Fiber Optic Gyro (FOG) is rapidly developed. The storage life of FOG is an important part of the life of FOG. On the analysis of theory of FOG and the theory of the reliability theory, this paper has a discussion on how to manage the storage life of the FOG. It brings out a way to evaluate the storage life of the FOG, and validates its feasibility through the...
As an important component, Super Luminescent Diode (SLD) is the most crucial factor that affects life and reliability of Interferotic Fiber Opitc Gyroscope(IFOG). Therefore, research on the reliability of SLD is the base of research on the reliability of IFOG. Research on the reliability of SLD was processed through accelerated life test (ALT). Based on related theoretic analysis, the sensitive stress...
The binary state is the fundamental assumption to the traditional FTA. Hence, the traditional FTA gives only the binary logical analysis of product catastrophic failures. However, performance of Fiber Optical Gyroscope (FOG) will degrade with the time and it is able to perform its task with partial performance. To overcome this problem, multistate reliability analysis is presented. However, multistate...
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