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Finite element models of heat spreader enhanced plastic ball grid array (EPBGA) packages with different structures, materials and process treatments had been developed in this study. Predicted result indicated that the difference of stress were not significant generated in the structures with single-layer and double-layer spreader respectively. The stress became smaller gradually with the increasing...
Interface delamination is one major reliability problem that may lead to multi-material structures products failure in microsystems package. To ensure the package reliability and to provide guidelines for package design and manufacture, a series of experiments are designed to study the adhesive strength between substrate and molding compound(MC) through charging molding parameters. On the other hand,...
Interface delamination is one major reliability problem that may lead to multi-material structures products failure in microsystems package. To ensure the package reliability and to provide guidelines for package design and manufacture, a series of experiments are designed to study the adhesive strength between substrate and molding compound(MC) through charging molding parameters. On the other hand,...
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