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Shrinking features and growing device complexity with today's advanced devices has led to increased challenges of gaining a full understanding of device thermal behavior. At the same time, with higher power densities having a full understanding of the device static and dynamic thermal behavior is essential for ensuring optimal tradeoffs between performance and device reliability. Thermal imaging based...
This study shows the results of a transient and steady-state thermal imaging, using an infrared (IR) imaging system and thermoreflectance (TR) imaging for comparison. The experiments, carried out on a wire-bond package and a flip-chip package of a CMOS thermal test chip, show the characteristics of localized heating and the mass heat capacitance depending on the package. Both chips share an array...
A side-by-side comparison between thermoreflectance imaging (TR) and infrared (IR) imaging is made using a specially designed thermal test chip with an embedded diode sensor array. IR thermal imaging is commonly used in industry. However, due to the infrared wavelength and the diffraction limit, IR has limited spatial resolution for chip level thermal characterization. In this paper we compare the...
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