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Flexible Hybrid Electronics combine the best characteristics of printed electronics and silicon ICs to create high performance, ultra-thin, physically flexible systems. Tests and methods are being developed to evaluate the reliability of these systems. Initial results are presented for flexible hybrid electronics systems.
Flexible Hybrid Electronics combine the best characteristics of printed electronics and silicon ICs to create high performance, ultra-thin, physically flexible systems. Advances in converting commercial off-the-shelf products into the physically flexible FleX-IC format are presented. This paper examines the FleX-SoC, physically flexible System-on-Chip, and reports evaluation of the NVM after bending...
Flexible Hybrid Electronics combine the best characteristics of printed electronics and silicon ICs to create high performance, ultra-thin, physically flexible systems. New static and dynamic tests are being developed to evaluate the performance of these systems. Dynamic radius of curvature and torsional test results are presented for a flexible hybrid electronics system with a FleX Silicon-on-Polymer...
Flexible electronic systems have been limited by the ability to integrate IC functionality. Traditional silicon-based ICs are not flexible, and flexible transistors are too large and too slow to approach silicon-based IC density and performance. Transferring standard silicon IC wafers to polymer substrates addresses these limitations by transforming traditional ICs into a physically flexible form...
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