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This paper presents a novel piezoresistive sensor detecting a temperature compensated sum of the three mechanical normal stress components including the Out-of-plane stress iquestzz. The sensor is based on CMOS-compatible diffusions designed to exploit vertical currents. We show that the temperature compensated stress sum can be extracted via two different sensor designs and even with a single device...
High-speed chip-to-chip interconnect utilizing flex-circuit technology is investigated for extending the lifetime of copper-based system-level channels. Proper construction of the flex ribbon is shown to improve the raw bandwidth over standard FR-4 boards by about three times. Active testing results from a 130-nm CMOS test vehicle show the potential of up to two times higher data rates. The next-generation...
High-speed chip-to-chip interconnect utilizing flex-circuit technology is investigated for extending the lifetime of copper-based system-level channels. Proper construction of the flex ribbon is shown to improve the raw bandwidth over FR-4 boards by about three times. Active testing results from a 130-nm CMOS test vehicle show the potential of two times higher data rates. The next generation test...
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