The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This paper comprises the numerical approach and the experimental validation technique developed to obtain the residual stresses building up during encapsulation process of integrated circuits. Residual stresses can be divided into cure and cooling induced parts. The curing originated stress had been mostly neglected in the literature and a special attention had always been given to detection of the...
This paper comprises a numerical constitutive model for evaluating residual stresses generated during encapsulation of integrated circuits. Residual stress is a consequence of molding process which can be divided in cure and thermal induced parts. Cure originated stress had been mostly neglected in literature and a special attention had always been given to detection of thermal induced stresses. In...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.