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Effects of binder chemistry on the electrical conductivity of epoxy-based adhesives containing conventional silver micro-particles were investigated. Although no nano-sized fillers or organometallic precursors for nanoparticles were mixed into the adhesives, low temperature sintering of the micro-particles was successfully induced during curing at 200 °C when a bi-functional mercaptocarboxylate was...
An epoxy-based electrically conductive adhesive containing Cu microrods as a filler was prepared using an amine-based hardener. This adhesive can exhibit a low electrical resistivity of 10−4 Ωcm after curing in air. The development of electrical conduction paths in the adhesive was dynamically analyzed by viscoelastic characterization combined with electrical resistance monitoring. Conduction paths...
Generation of electrical conductivity in electrically conductive adhesives (ECAs) composed of epoxy-based binders was investigated. Development of conduction paths for electrons in the ECAs was found to consist of two elementary processes, microstructure formation of a filler-network and development of inter-filler electrical conductivity. Microstructure formation of the filler-network occurred in...
Electrical conductivity evolution of ECAs composed of epoxy-based binders during curing was analyzed using an in-situ viscoelastic characterization (free-damped oscillation method). Variation in electrical conductivity of ECAs was monitored concurrently with the viscoelastic characterization. This work clarified that increase in electrical conductivity of ECAs during curing does not always relate...
The effect of chemical processes on the evolution of electrical conductivity in a typical electrically conductive adhesive (ECA) composed of an epoxy-based binder containing Ag filler particles has been investigated. The electrical resistivities of the test specimens were found to differ depending on the curing temperature. Moreover, the specimens containing Ag fillers with adipic acid surfactant...
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