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We report a new method to fabricate multilayer interconnections without requiring wet or dry etching or deposition of insulating layers. Three levels of electrical connections are obtained by merely repeating deposition, photolithography, and anodization of a metal layer. Without the need to etch metal layers or deposit and etch insulation layers, the overall process is simple, cheap, safe, and of...
Solid phase extraction was incorporated into an electrowetting-on-dielectric chip for radiochemical purification of a positron emission tomography tracer that was radiolabeled on the same chip. The radiotracer droplet was mixed with alumina particles, and the alumina particles were filtered out from the droplet through a line of pillars, all by electrowetting droplet movement. Fluorination reaction...
Anodized dielectrics in a mirrored arrangement are proposed and evaluated for the parallel-plate electrowetting-on-dielectric (EWOD) configuration. As valve metal oxides with current rectifying effects, anodized dielectrics previously could only be used for EWOD under a restricted range of voltages. However, in a mirrored configuration, one side of the anodized dielectric pair is expected to always...
This paper demonstrates the use of impedance sensing in an electrowetting-on-dielectric (EWOD) chip to monitor the progress of a chemical reaction. Sensing is achieved by measuring the current through a sample droplet with the aid of a lock-in amplifier. Monitoring of the reaction of HCl with NaOH (i.e., during a titration) was demonstrated. A sharp minimum in the impedance signal was observed at...
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