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Failure analysis and material characterization for power electronics packaging is critical, yet extremely challenging due to the large variety of technologies and materials employed. The current paper presents two case studies describing how defects at the nano-and microscale can greatly impact the performance and functionality of the entire power module. The first example correlates the microstructure...
Current developments in the automotive and aerospace industries frequently result in increasing temperatures, reliability and lifetime requirements for power electronic components, modules, and systems. In this context, a key aspect with enormous potential for improvement is the packaging. This includes the required implementation of new advanced materials for high temperature applications of up to...
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