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Conductive adhesives have been widely used in die mounting and component terminal bonding in certain types of hybrid circuits for a number of years. ECA (Electrically conductive adhesive) is an alternative to lead-free solder for certain specific applications in electronic products. Low processing temperature, fine pitch, flexible process steps, and no flux residues are some of the major advantages...
Lead free solder alloys have been developed which contain small concentrations of rare earth additives such as cerium and lanthanum. It is believed that rare earth element additives refine the microstructure of the solder and improve the mechanical durability and thermomechanical integrity of lead free solder joints. This paper presents the results of a comparative analysis of solder joints with the...
This paper described a new board-level free fall drop (BFFD) and its application in the evaluation of solder joints in fine pitch ball grid array (BGA) or chip-scale packaging (CSP) assemblies. This drop test method simulates the product-level free fall or phone level drop test (PFFD), which was widely used in the industry. A comparison study between solder alloys using Sn-Ag-Cu (SAC) and SnPb were...
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