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This work investigates the effects of encapsulation on deformation behavior and fatigue lifetime of horseshoe-patterned stretchable interconnects, under uniaxial cyclic tensile loading. The finite element software ABAQUS is applied to analyze the deformational behavior of stretchable interconnects under different cyclic stretching conditions (10%, 15% and 20% elongation). Then according to the finite...
In this paper, the delamination behavior of an end-linked PDMS/copper interface is investigated through molecular dynamics simulations. A stepwise end-linking protocol based on an iterative MD simulation/energy minimization is utilized to develop the post-cured microstructure of the PDMS. Stress versus strain relation is calculated to understand the PDMS/copper interfacial tensile strength and thus...
Stretchable electronics can not only maintain the functional integrity of traditional planar and rigid devices, but also deform along with the sophisticated three-dimensional surface. Typical applications can be found in healthcare, biomedical implants and wearable functional clothes. In these systems, their stretchablity can be realized by means of designing different curved metallic wires embed...
This work investigates structure analysis and design of metal interconnects for stretchable electronic circuits using the finite element software ABAQUS. In order to design a more promising structure of metal interconnect, the performance of different parameters (the inner radius, the angle and the width of the copper trace) of horseshoe shape is compared under the condition of uniaxial tensile. In...
This article provides a method to perform finite element analysis (FEA) and theoretical analysis on stress and strain characteristics of plastic ball grid array (PBGA) assembly under the random vibration environment. For the mixed solder joints, ball diameter, ball pitch and ball array were selected as three critical parameters. By using a L9 (34) orthogonal matrix, the mixed solder joints of PBGA...
The influence mechanism of different pad types (SMD and NSMD) on the shear performance of Sn3.0Ag0.5Cu/Cu solder joint was investigated by experiment and Finite Element Analysis (FEA) method. The shear force of NSMD solder joint was significantly higher than SMD solder joint by using ball shear test method according to JSED22-B117A standard. The difference in shear force was attributed to the different...
The relationship between reflow profile parameters (soak temperature and soak time, reflow temperature and reflow time, cooling rate) and shear performance of Sn3.0Ag0.5Cu/Cu solder joint was investigated. It was found that soak time, reflow temperature and cooling rate had significant influence on the shear performance of Sn3.0Ag0.5Cu/Cu. Adequately prolong soak time and increase reflow temperature...
This work investigates structure analysis and design of metal interconnects for stretchable electronic circuits using the finite element software ABAQUS. In order to design a more promising structure of metal interconnect, the performance of different parameters (the inner radius, the angle and the width of the copper trace) of horseshoe shape is compared under the condition of uniaxial tensile. In...
Recently, LED lighting receives extensive attention and is put in practice in many respects with the great advantages of low power consumption, high luminous efficiency and long service life. However, it is confronted with lots of problems such as light failure and short service life caused by high temperature of LED chip. So the thermal management is one of the most important aspects of successful...
As a new kind of semiconductor photoelectric device, Light-emitting diodes (LEDs) have begun to play an important role in many illumination applications due to their excellent performance in terms of high brightness, energy-saving and environment friendly. However, thermal management is one of the major issues to be improved for implementing LEDs into illumination applications because heat affects...
LED with many advantages such as high brightness, long-lifetime, and energy-saving has been successfully applied to various fields, especially on special lighting applications. At low temperatures, LED is more uniform in illumination and has a higher luminous efficiency, which is regarded as the next generation refrigeration system lighting. As well as in some cold regions, LED has also become the...
In order to improve the thermal fatigue lifetime of Package-on-Package (PoP), this paper taking PoP thermal reliability the cost and rework into consideration, different edge bonding structure (i.e. 100% edge bonding, 50% edge bonding, and 10% edge bonding) are used to improve thermal reliability. At the same time, the effect of different edge bonding patterns (i.e. only the bottom packege, or both...
The degradation of high power white and blue light-emitting diodes (LEDs) was investigated by considering the electrical, optical and phosphor conversion. The LED samples were tested at the elevated temperature of 40°C with 700mA, 900mA, 1200mA. In order to research the degradation rule of fluorescent power in white LED, aging studies using white and blue LEDs with same batch of chips under same invariableness...
LED lighting becomes the forth generation green lighting. However, in terms of LED development and large-scale application, the reliability of LED has become one of the technical bottlenecks. This paper carried out the research on the thermal-humidity reliability of high power LED module by the means of experiment and simulation, which mainly aims at the reliability problems existed in high power...
LED lighting is referenced as the forth generation green lighting with the great advantages of low power consumption, high luminous efficiency and long service life. Thermal management is one of the most important aspects of successful LED systems design. In this paper, a novel packaging structure for high power multi-chip LED was proposed and investigated. Firstly, Chip on Board (COB) technology...
As the fourth-generation lighting, LED attracts a lot of public attention with the advantages of high luminous efficiency, energy-efficiency, environment protection and long lifetime. Stress is one of the most important reasons in affecting high power LED (HP-LED) reliability and lifetime. The stress may be generated from heat, current or humidity, and has bad influence on LED reliability. In this...
This paper presents the investigation for the electrical characterization of PMNT (lead magnesium niobate - lead titanate) thin-films with different fabrication parameters. The PMNT thin-films are processed under different conditions. Electrical characterization results including capacitance-voltage (C-V) measurements at different voltages and frequencies are presented.
In this paper, the Sn3.0Ag0.5Cu and 63Sn37Pb were mixed by a certain mass ratio to research reliability of mixed solder material. Firstly, in order to obtain the data of the 9 fitting Anand parameters of mixed solder joint material, a series of tensile tests were carried out under the condition of 5 strain rates from 5.0E-5/s to 1.0E-3/s and at 4 temperatures 253K, 298K, 348K and 398K. Secondly, the...
According to Solid-State Lighting Manufacturing Roadmap 2009, lower cost and higher reliability are two key necessities for LED lighting. In this paper, an optimization process of thermal design for LED lighting system is carried out from the perspective of system in packaging. Based on the three-dimensional thermo-mechanical model of LED lighting system, the thermal and mechanical performance of...
Nowadays LEDs (Light Emitting Diodes) are widely used in many fields. As the fourth generation of lighting sources, LEDs have the advantages of long lifetime, power saving and environment-friendly. In this paper, the thermal variation characteristic of some parameters for two high-power LEDs packaging modules, such as forward voltage, luminous flux, CCT and luminous efficiency, were analyzed experimentally...
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