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This paper proposes a novel approach for segmenting primary video objects by using Complementary Convolutional Neural Networks (CCNN) and neighborhood reversible flow. The proposed approach first pre-trains CCNN on massive images with manually annotated salient objects in an end-to-end manner, and the trained CCNN has two separate branches that simultaneously handle two complementary tasks, i.e.,...
The mechanical properties and microscopic mechanism of the solder joint at cryogenic temperature were studied. The effects of temperature and Pb content on the reliability of the solder joint were investigated. The temperature has a significant influence on the shear strength of the solder joint. As the temperature decreases, the shear strength increases continuously, and the shear strength of solder...
In order to investigate the reliability of micro-interconnecting copper pillar bump under thermal-electric coupling, the test chip with electrified daisy chain copper pillar bumps was designed and manufactured. And 9 sets of thermoelectric coupling accelerated life test were carried out respectively, which the resistance increased by 10% was considered as the failure threshold to get the mean-time-to-failure...
With the decrease in the overall size and the rapid increase in the working frequencies of printed circuit boards, the reliability of solder joints, especially the high frequency signal transmission reliability has become the key factor in system reliability. In this paper, changes in RF impedance of solder joints in a temperature cycling environment was studied using time-domain reflectometry measurements...
The board level vibration reliability of the Package-on-Package (PoP) structure with different underfill types was investigated by finite element method (FEM). Underfill methods used in this study were the full-filled method, the corer-bonded method and the edge-bonded method. Results show that all of them can obviously improve the reliability of PoP structure in random vibration environment. The...
In this study, a 3D copper pillar bumps model was established to investigate the reliability of the interconnection under thermal-electric coupling. In order to ensure the accuracy of the model, infrared thermography was used to verify the simulation of temperature distribution. The test not only proved the feasibility of this model, but it also indicated impact of Joule heat effect on temperature...
This paper investigates the reliability of the Package-on-Package (PoP) under random vibration loading by experimental tests and FEM simulations. An event detector was used to monitor the PoP failure times under random vibration. A finite element model of the PoP assembly model was built in ANSYS, and the natural frequencies and modes were calculated and verified by experimental model test. The results...
Thermal resistance experiments based on electrical method were carried out on a commercial bipolar junction transistors (BJT) device. After extracting the thermal time constant, duty-cycle dependent pulse thermal resistance of the device were achieved. To verify the calculated results, both static and pulse infrared (IR) thermal imaging measurements were carried out. Good agreements were achieved...
Along with the improvement of equipment reliability, human error has become a great threat to the power system reliability and safety. However, the research of human reliability analysis in power system is still in its infancy. There is still little approach for quantitatively measuring the human reliability of power system. In this paper, the definition of human reliability of power system and a...
The metallurgical structure and mechanical shear performance of replated solder bumps were studied. Firstly, the original lead-free interconnect bumps were removed by melt method and the SnPb solder bumps were soldered on the original soldering interface. Then the cross sections of replated bumps were obtained by polishing and the metallurgical structure and the composition of intermetallic layer...
System performance of cellular networks could be improved by D2D communication. A retransmission scheme within D2D group is proposed for the case of data sharing. When all the D2D UEs failed to get data packet from BS by cellular links, retransmission is still carried out within the group. Because of the enhancement of receiving SNR, a UE could decode the data with a higher probability. Analysis and...
In order to understand the vibration characteristic of plastic BGA solder joints, the test vehicles with daisy chain were designed, vibration reliability test platform and real-time monitoring platform were developed, a series of vibration test including sweep vibration at different levels and random vibration were conducted, and the comparative study for experiments and simulation results was carried...
The PBGA assembly test samples which contain daisy chain patterns were designed; vibration reliability test platform and real-time monitoring platform called Event Detector from Analysis Tech were developed. The vibration reliability test and failure analysis were performed, and the comparative study for experiments and simulation results was carried out. The results showed that the outermost corner...
Along with the more and more use of portable electronic products, such as mobile phones and PDA, the drop impact performance of solder joints for CSP is a critical concern to semiconductor and electronic product manufacturers. This problem is more serious with the application of lead free soldering, because compared with the traditional SnPb solder alloy, lead free solder alloy have higher rigidity...
Because of higher assembling density, better electrical and mechanical performances and higher reliability than other package styles, more and more BGA package styles are widely and successfully used. Micro crack induced by process stress becomes one of the critical factors which affect yield and long term reliability of BGA solder joints. It becomes more serious with the application of lead free...
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