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Sn-rich Au-Sn solder bonding has been systematically investigated for low cost and low temperature wafer-level hermetic packaging of high-end MEMS devices. The AuSn2 phase with the highest Vickers-hardness among the four stable intermetallic compounds of Au-Sn system makes major contribution to the high bonding strength. The maximum shear strength of 64 MPa and a leak rate lower than 1 × 10−7 torr·l/s...
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