Search results for: Yongping Pu
Journal of the American Ceramic Society > 107 > 4 > 2360 - 2370
Journal of the American Ceramic Society > 105 > 7 > 4796 - 4804
Journal of the American Ceramic Society > 103 > 12 > 6811 - 6821
Journal of Materials Science: Materials in Electronics > 2019 > 30 > 21 > 19654- 19663
Journal of Materials Science: Materials in Electronics > 2019 > 30 > 14 > 12950- 12955
Journal of Materials Science: Materials in Electronics > 2019 > 30 > 12 > 11412- 11418
Journal of Materials Science > 2018 > 53 > 24 > 16243- 16251
Journal of the European Ceramic Society > 2018 > 38 > 5 > 2304-2311
Journal of Materials Science > 2018 > 53 > 13 > 9830-9841
Journal of Alloys and Compounds > 2018 > 740 > C > 1180-1187
Journal of Materials Science: Materials in Electronics > 2018 > 29 > 8 > 6556-6563
Journal of Materials Science: Materials in Electronics > 2018 > 29 > 6 > 5158-5162
Journal of Materials Science: Materials in Electronics > 2018 > 29 > 6 > 4668-4674
Materials Letters > 2017 > 201 > C > 203-206
Ceramics International > 2017 > 43 > S1 > S115-S120
Ceramics International > 2017 > 43 > S1 > S85-S91
Ceramics International > 2017 > 43 > S1 > S59-S63
Journal of Materials Science: Materials in Electronics > 2017 > 28 > 21 > 16336- 16340
Scripta Materialia > 2017 > 136 > C > 55-58
Journal of Alloys and Compounds > 2017 > 711 > C > 319-326