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A novel low-temperature, pressureless bonding approach by electroless plating with controlled flow through a microfluidic device, in which a laminar forced convection flow of electroless solution was passing through a microchannel between dies and to gaps between copper pillars, was developed to metallically interconnect copper pillars together. Previous study had been demonstrated that, with the...
2.5D integration requires vertical stacking of dies while forming permanent electrical and mechanical connections between the input/output pins of the devices. Through silicon via (TSV) is one of the key elements for 2.5D integration. This paper presents a full process integration solution for interposer with 10×100μm copper filled TSVs, which involves TSV etch, TSV insulation, barrier and seed layer...
We report our investigation on structural and magnetic properties of double perovskite Sr2FeMoO6 (SFMO) films fabricated at different annealing temperatures. Structural properties have been investigated by means of X-ray absorption near-edge spectra and extended X-ray fine structure, where a change of oxidation state has been observed depending on the annealing temperature. It is found that the oxidation...
Using pure electric voltages instead of magnetic fields or large currents to manipulate magnetisms in multiferroic heterostructures is a goal for future low-power spintronics such as electric-writing magnetic-reading memories. Usually, the electric manipulation to magnetism shows a volatile effect which cannot be used for information storage,[1] because the magnetic variation vanishes after the electric...
This paper reports the low-frequency reinforced ferroelectric acoustic actuators with high performances. In order to achieve a higher output sound pressure level and wider frequency response range, we have proposed the novel rubber/resin bi-layer acoustic diaphragm. From the simulated and measured frequency response results, the ferroelectric acoustic actuators with a rubber/resin bi-layer diaphragm...
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