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During the operation of a Thermoelectric (TE) module, one side of it has thermal expansion and the other side has cooling shrinkage. The corresponding resulted tensile and compressive stresses at the interfaces of its constituent materials will often cause the fatigue failure, especially during the repeated operations of the module. However, knowing the life of TE Modules is often required no matter...
A high performance 22/20nm CMOS bulk FinFET achieves the best in-class N/P Ion values of 1200/1100 μA/μm for Ioff=100nA/μm at 1V. Excellent device electrostatic control is demonstrated for gate length (Lgate) down to 20nm. Dual-Epitaxy and multiple stressors are essential to boost the device performance. Dual workfunction (WF) with an advanced High-K/Metal gate (HK/MG) stack is deployed in an integration-friendly...
Accelerated thermal cycling (ATC) test, though time-consuming, is currently the most widely used reliability test for electronic components. However, a much faster mechanical bend test is often adopted as an alternative for the ATC test. But it is a general guideline that the mechanical reliability test results are meaningful only if the mechanical stresses applied on the test components are either...
In this study, the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions against eutectic SnPb, SAC105, and SAC305 alloys. The Mn or Ce doped low cost SAC105 alloys achieved a higher drop test and dynamic bending test reliability than SAC105 and SAC305, and exceeded SnPb for some test...
In this study, the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions against eutectic SnPb, SAC105, and SAC305 alloys. The Mn or Ce doped low cost SAC105 alloys achieved a higher drop test and dynamic bending test reliability than SAC105 and SAC305, and exceeded SnPb for some test...
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