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We demonstrate selectively-grown GaAs nano/micro structures on silicon substrates by molecular beam epitaxy. Hexagonal or rectangular shaped GaAs crystals, depending on the orientation of the silicon substrate, were formed inside the silicon-dioxide-masked nanoholes at 630°C. Clear facets, which are the low-energy {011} planes, indicate single-crystalline nature of the growth. GaAs/InAs/GaAs structure...
With the developed process, four MEMS tensile testing chips of <;110>;-oriented single crystal silicon (SCS) nanobeams were achieved in one SOI wafer with thickness from 45 to 100 nm. Mounting the chips onto a custom made TEM sample holder, which integrated also comb drives and force sensor beam, in-situ TEM tensile tests were carried out. The measured Young's modulus (from 74 Gpa to...
A laser opening technique is employed as the photolithography process to form selective emitter (SE) structures on multi-crystalline silicon (mc-Si) substrates for the large-area (156 × 156 × mm2) solar-cell industry. The best efficiency of 16.35% is obtained with the developed SE structure after a damage removal process with optimisation of heavily and lightly doped dopants, which yields a gain of...
The feasibility of transforming completed CMOS/MEMS circuitry and designs from their rigid form realized in a silicon chip into a stretchable system is investigated by fabricating matrix arrays of silicon segments mechanically interconnected with deformable beams. High aspect ratio silicon beams are used both as molds and scaffolds for fabricating structures of Parylene and silicon-Parylene beams...
In this paper, development and characterization of a freestanding electroplated copper interconnect for applications in flexible and stretchable electronics is presented. The copper layer with typical thickness of 5 mum is plated into a photoresist mould realizing meander and mesh-like patterns. These are subsequently released resulting in a free-standing electrical interconnect that is optionally...
In this contribution, our progress in development of deformable single-crystalline-silicon electronics by modification of the previously reported ultra-thin and flexible CIRCONFLEX technology is presented. Additional deformability/reliability is achieved by lateral segmentation of silicon/dielectric layers and connecting these using flexible electrical interconnect. In the current study, segment thickness...
In this paper, results of experiments and FE simulations on mechanical issues of poly-and single crystalline silicon on ultra-thin polyimide substrates are presented. Formation and propagation of cracks within the silicon and dielectric layers are then studied under controlled bending and tensile tests using bending and tensile tools being custom designed for this purpose. The results show that the...
Initial studies have demonstrated that specially designed and fabricated microelectronics embedded in flexible substrates can maintain functionality when subjected to stretching as well as bending. The acceptable flexibility and stretchability for ultra-thin substrate could be reached by embedding the ultra-thin substrate into flexible polyimide and patterning the silicon into square or hexagon segmentations...
The acceptable flexibility and stretchability for ultra-thin substrate would be reached by embedding the ultra-thin substrate into the flexible polyimide/silica rubber and patterning the poly-silicon or silicon into square/hexagon segmentations. The segments interconnect by metal wires for the signal communication, different wire shapes are designed to reach more flexible. In this contribution, results...
The acceptable flexibility for ultra-thin substrate would be reached by embedding the ultra-thin substrate into the flexible polyimide and patterning the poly-silicon or silicon into square segmentations. In this contribution, results of experiments and FE simulations on mechanical reliability issues of poly- and single crystalline silicon on ultra-thin polyimide substrates are presented. Generation...
Benzocyclobutene (BCB) based intracortical neural implants for basic neuroscience research in animal models was fabricated, in which microfluidic channel was embedded to deliver chemical reagents. BCB presents several attractive features for chronic applications: flexibility, biocompatibility, desirable chemical and electrical properties, and can be easily manufactured using existing batch microfabrication...
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