The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The morphological evolutions of FePt–X (segregant) thin films were studied by employing a 3-D phase field model. Numerical simulation results show that in the absence of substrate constraint related with elastic energy, the morphology of the FePt–X thin films significantly depends on the interfacial energy, film thickness, and anisotropic atomic mobility. The large interfacial energy between FePt...
MnGa compounds possess several fascinating and useful properties, such as a large magnetocrys-talline anisotropy Ku, a high spin polarization P, a high Curie temperature TC and a flexible magnetization M. These results suggest that MnGa compounds are of potential candidates for spin-transfer-torque and rare-earth-free permanent magnet applications [1-2]. There are two most interesting tetragonal phases,...
The SnPb solder ball was reflowed on the Cu film in a flow of reducing gas, and the reactive spreading process was in situ recorded by a CCD camera. On the thicker Cu films, it was observed that dewetting did not happen even if the Cu6Sn5 intermetallic compounds spalled into the liquid solder. However, on the thinner Cu films, dewetting would occur when the liquid SnPb solder consumed the underneath...
The sputter-deposited Cu thin film, coated with a thinner gold layer, was prepared into the butterfly pattern with alternating zones beween Cu thin film and Si. The eutectic SnPb solder balls with different sizes were reflowed on the butterfly pattern. As a result, the liquid solder would be selectively retained on the Au/Cu film zones. At the same time, under the energy minimization control, the...
The SnPb solder ball was reflowed on the Cu film in a flow of reducing gas, and the reactive spreading process was in situ recorded by a CCD camera. On the thicker Cu films, it was observed that dewetting did not happen even if the Cu6Sn5 intermetallic compounds spalled into the liquid solder. However, on the thinner Cu films, dewetting would occur when the liquid SnPb solder consumed the underneath...
The sputter-deposited Cu thin film, coated with a thinner gold layer, was prepared into the butterfly pattern with alternating zones beween Cu thin film and Si. The eutectic SnPb solder balls with different sizes were reflowed on the butterfly pattern. As a result, the liquid solder would be selectively retained on the Au/Cu film zones. At the same time, under the energy minimization control, the...
In-Ga-Zn oxide (IGZO) TFTs was fabricated by ink-jet printing technology on a silicon substrate with SiO2 on top. The device fabrication process includes printing ITO electrodes and IGZO semiconductor layer. A typical printed TFT shows a mobility of 0.32 cm2/V s and a contact resistance of ∼1 MΩ. Device performance was further improved by inserting an IZO layer between the source/drain electrode and...
Characterization of a n-type Field Effect Transistor (FET) made from direct growth and patterning of a dense single wall carbon nanotubes (SWNTs) network on a silicon substrate, using alcohol as source gas, is presented. This SWNTs network film made into FET has a special feature which is significantly different from the amorphous silicon thin film transistor (TFT) or the MOSFET. The primary n-type...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.