A stereological analysis was carried out in order to obtain the kinetics parameters of the (Cu 1−x Ni x ) 6 Sn 5 growth in the diffusion soldered (Cu–5 at.%Ni)/Sn/(Cu–5 at.%Ni) interconnections where previously anomalous fast growth of this phase was described. The n-parameter in the equation x = kt n was found to be 0.27–0.15 in the temperature range 240–260 °C,...
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