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Drop test for solder joint reliability is critical for all area arrays and perimeter-leaded surface mount semiconductor devices typically used in handheld electronic products. Joint Electron Device Engineering Council, JEDEC, published a new test standard, JESD22-B111A, to be the revision of the JESD22-B111 for board level drop test in November, 2016. The major differences between JESD22-B111 and...
High bandwidth Package on Package (HBPoP) had be well used which replaced FCMAPPOP in high-end mobile products with its advantages of wide I/O counts, high performance and the better integration between application processor and stacked memory packages. The structure of HBPoP is utilized flip-chip technology with ball grid array (BGA) balls on the bottom package and connect top DRAM package with substrate...
The molded underfill (MUF) process for system in package (SiP) assembly has been applied for years and is still in production. However, the shrinkage in package size, cost reduction and improving electrical performance are driving the development of dual side molding package. The development of dual side molding technology faces the challenge of moldability. The moldability is largely influenced by...
2.5D IC integrates heterogeneous chips by interposer with the technologies of through silicon via and re-distribution layer on it. It has the structure that chips are stacked on interposer then mounted on substrate with numerous micro-bumps and C4 bumps. For 2.5D IC package development, warpage control and interlayer dielectric interface stress minimization for potential delamination risk elimination...
In recent years, there has been a dramatic proliferation of research concerned with electronic products because of more various functions are integrate into the device and product's size has become smaller. As a result of these functional requirements, through silicon via (TSV) was investigated, this are getting considerable attentions not only from reducing the packaging size but also from shortening...
In the wake of the recent dramatic advances made in electronic products, product size has become smaller and smaller. As a result of this, electronic components will be affected easily by environmental factors such as humidity, pressure, and temperature. This paper discusses the flip chip packaging, which is affected by changes in temperature. Because the electronic components often failed by thermo-mechanical...
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